MLED Massive Transfer Laser Bonding
The device uses a 980nm infrared laser to precisely align and force control the glass carrier plate pre installed with LED chips with the target substrate before laser welding.
The use of duplex substrate workbenches, glass carrier workbenches, and dual CCD alignment systems maximizes equipment production capacity. Upload MES, product production data can be traced.
MLED Massive Transfer Laser Bonding
The use of duplex substrate workbenches, glass carrier workbenches, and dual CCD alignment systems maximizes equipment production capacity. Upload MES, product production data can be traced.
Device parameters
CCD image positioning system
The equipment adopts CCD image positioning system, high-precision and high-speed linear motor, and micrometer level marble platform
Welding accuracy (X/Y)
<± 10μm
Equipped
Equipped with a automatic loading and unloading system
Device parameters
| Content | Specifications |
|---|---|
| Production efficiency | UPH ＞3KK |
| Accuracy | (X/Y)< ±10μm |
| Substrate Size | 80×80mm-210×210mm(t0.1-2.5mm) |
| Welding Yield | ＞99.997% |
| Infrared laser spot size | 200mm*10mm |
| 9 | MITSUISEKI |
| 10 | OKAMOTO |
| 11 | Qinghong |
| 12 | Qinghong |
| Laser uniformity | ＞98% |
